Product Details
Ceramic Plate Wafer Chuck Plate for Semiconductor
This Alumina Ceramic Plate is is a component manufactured from high purity alumina. It is used in semiconductor and precision equipment to securely hold, support, and precisely position wafers, while working in combination with vacuum or airflow systems to ensure stable transfer, handling, and processing throughout automated manufacturing steps.These ceramic wafer plates play a critical role in applications demanding exceptional precision, high operational stability, and rigorous contamination resistance. Get a quote with drawings.

Materials of Ceramic Plate
1. 95%--99.99% Alumina / Aluminum Oxide (Al2O3)
2. zirconia / Zirconium (ZrO2)
3. silicon carbide (SiC)
4. silicon nitride (Si3N4)
Ceramic Plate for Semiconductor is the most economical and widely used for wafer handling. Silicon Carbide Ceramic Plate provides lightweight, high rigidity, and excellent plasma resistance. Silicon Nitride Ceramic Plate combines high strength, low particle generation, and superior reliability for high end semiconductor applications.
Advantages of Semiconductor Ceramic Plates
1. High Hardness and Wear Resistance: Possessing a hardness level comparable to or exceeding that of metals, they can withstand frequent operations and frictional forces, thereby extending their service life.
2. High-Temperature Resistance: Capable of operating stably in high-temperature environments, making them suitable for processes such as semiconductor thermal treatment.
3. Low Coefficient of Thermal Expansion: Exhibits minimal deformation when subjected to heat, thereby ensuring operational precision.
4. Electrical Insulation and Corrosion Resistance:** Non-conductive and free from metal ion generation—preventing contamination of sensitive objects—while also offering resistance to acid and alkali corrosion.
5. Lightweight Design: It is lighter in weight compared to metal counterparts, which reduces the load on the robotic arm and enhances motion efficiency.
Applications of Ceramic Disc Plates
1. Semiconductor Manufacturing: Transporting wafers within vacuum or cleanroom environments while preventing contamination.
2. Precision Machining: Handling components requiring extremely high precision, such as optical lenses and MEMS devices.
3. Medical Robotics: Performing delicate manipulations during minimally invasive surgical procedures, ensuring both biocompatibility and safety.
4. Aerospace: Executing tasks within extreme environments characterized by conditions such as high vacuum or intense radiation.
Why Choose Mingrui Ceramic
Direct Manufacturer with35,000㎡factory
Fromprototype to mass production
Tight tolerance up to±0.001mm
20+senior engineers supporting material selection, design optimization, and drawing evaluation.
Manufacturing and Machining Capabilities
We can produce different sizes and shapes of the ceramic robotic arms for specific applications to different custom products.Such as drilling, polishing, stripes, concave and convex, screw holes, metal parts position and so on-going.

| Machining Precision Technical Data | |
| Dimensional accuracy | Up to 0.001mm |
| Concentricity | Up to 0.003mm |
| Parallelism | Up to 0.002mm |
| The inner hole tolerance | The minimum 0.005mm |
| Straight flute | The narrowest 0.1x100mm |
| The thickness of the size | Minimum to 0.02mm |
| The screw thread | Minimum internal thread M2 |
| Cylindricity | Up to 0.004mm |
| The linear tolerance | Up to 0.001mm |
| The smallest aperture | The minimum 0.07mm |
| Precision process | CNC maching,grinding,lapping |
| Surface finish | Glazed,polishing or metallized |
* We mainly manufacture according to drawings or samples.
If you have any questions or requirements, please feel free to contact us or send us an email at:[email protected]

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